Sep 30 - Oct 2, 2026
Hyatt Regency, Greenville SC
Todd Chesna, Ford
2025 APS Keynote Speaker Todd Chesna, Manager – Packaging Engineering at Ford, shares strategies for integrating and optimizing packaging in new vehicle programs.
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Featuring Subject-Matter Experts From:
FordScoutSubaruTextronBMWHondaMercedes-BenzNissanMazdaCaterpillarPaccarTeslaVolvoFerrariGMAGCOAutoForecast SolutionsCumminsPackaging SchoolHarley-DavidsonIsuzuKubotaRivianToyotaYamahaZoox
An average production automobile has 30,000 parts and tens of thousands of associated packages throughout the vehicle’s life cycle.
All the right folks, gathered in ONE room
At the Automotive Packaging Summit, we explore the specific packaging and logistics challenges faced by OEMs and Tier1 Part Suppliers, and their impact on Transportation and Logistics. Industry veterans and Packaging Experts specializing in Automotive Packaging Solutions share insights to streamline this process through knowledge sharing.
2025 Highlights
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Hear directly from packaging leaders who've been in the room.
Its a one-day, one-stop shop, 100% effort to try to get problems solved.
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Subject-Matter Experts
Thank You to our industry veterans for their contributions to the Automotive Packaging Summit.
Dan Belbey
BMW
Dana Blair
NTIC Zerust
Jonathan Brekan
Daubert Cromwell
Matt Bublick
Product Movers
Dan Casillo
Ventek Solutions
Daniel Castaneda
PakFab
Todd Chesna
Ford Motor Company
Terry Craig
ArPlank Direct
Connor DeYoung
Mazda
Trevor Franken
Toyota
Jeremy Galanty
General Motors
Bridget Grewal
Magna
Carlos Gutierrez
Volvo Cars US
Ben Hesskamp
Guardian Container Consulting
Lowell Huffman
rePurpose Global
Andrew Hurley
PackagingSchool.com
Kelsey Kester
BMW
Nathan Kilcoyne
Nissan North America
Patrick Mahoney
CHEP
Joseph McCabe
AFS
Nasser Nasser
General Motors
Vidya Seeram
Volvo
Alex Seger
Nissan North America
Matthias Stiller
Jonas & Redmann Automationstechnik GmbH
Dan Universal
Isuzu North American Corporation
Thank You To Our 2026 Sponsors
With their commitment to the industry, our sponsors and the Packaging School continue to amplify the event experience and the industry it serves.
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Our Title Sponsor
TriEnda is a U.S. based global manufacturer of thermoformed packaging and material handling solutions. With a heritage of over 40 years of industry expertise, excellent custom designs, and experienced teams, TriEnda leads the thermoforming industry in innovation and service.
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